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With the rapid development of electronic technology, only by recognizing the development trend of PCB technology, circuit board manufacturers can actively develop and innovate production technology to find a way in the highly competitive PCB industry. Circuit board manufacturers must always maintain the awareness of development. The following are some views on the development of PCB production and processing technology:
1. Develop component embedding technology
Component embedding technology is a huge change in PCB functional integrated circuits. The formation of semiconductor devices (called active components), electronic components (called passive components) or passive components on the inner layer of the PCB has begun. Production, but to develop circuit board manufacturers must first solve the analog design method, production technology, inspection quality, and reliability assurance are also urgent tasks. PCB factories must increase resource investment in systems including design, equipment, testing, and simulation to maintain strong vitality.
Several major trends of PCB technology development and innovation in circuit board factories
2. HDI technology is still the mainstream development direction
HDI technology promotes the development of mobile phones, drives the development of information processing and control basic frequency functions of LSI and CSP chips (packages), and the development of template substrates for circuit board packaging. It also promotes the development of PCBs. Therefore, circuit board manufacturers must innovate along the HDI road. PCB production and processing technology. As HDI embodies the most advanced technology of contemporary PCB, it brings fine wire and tiny aperture to PCB board. HDI multi-layer board application terminal electronic products-mobile phones (mobile phones) is a model of HDI cutting-edge development technology. In mobile phones, PCB motherboard micro-wires (50μm～75μm/50μm～75μm, wire width/spacing) have become the mainstream. In addition, the conductive layer and board thickness are thinner; the conductive pattern is refined, which brings high-density and high-performance electronic equipment .
3. Continuously introduce advanced production equipment and update circuit board manufacturing technology
HDI manufacturing has matured and tends to be perfect. With the development of PCB technology, although the commonly used subtractive manufacturing methods in the past still dominate, low-cost processes such as additive and semi-additive methods have begun to emerge. Using nanotechnology to make holes metallized and simultaneously form PCB conductive patterns, a novel manufacturing process for flexible boards. High reliability, high quality printing method, inkjet PCB process. Production of fine wires, new high-resolution photomasks and exposure devices, and laser direct exposure devices. Uniform plating equipment. Production components embedded (passive active components) manufacturing and installation equipment and facilities.
Several major trends of PCB technology development and innovation in circuit board factories
4. Develop higher performance PCB raw materials
Whether it is a rigid PCB circuit board or a flexible PCB circuit board material, with the global lead-free electronic products, these materials must be made more heat-resistant, so the new type of high Tg, small thermal expansion coefficient, small dielectric constant, and dielectric loss Good materials for angle tangent continue to emerge.
5. Bright prospects for photoelectric PCB
The photoelectric PCB circuit board uses the optical path layer and the circuit layer to transmit signals. The key to this new technology is to manufacture the optical path layer (optical waveguide layer). It is an organic polymer that is formed by methods such as lithography, laser ablation, and reactive ion etching. At present, this technology has been industrialized in Japan and the United States. As a major production country, Chinese circuit board manufacturers should also actively respond and keep up with the pace of scientific and technological development.
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